Do not proceed if TC2 does not hit 265°C minimum.
The Xemu Complex 4627 hot terminology originated in lead-free manufacturing (SAC305, SAC405). However, many military and aerospace repairs still use Sn63/Pb37 (tin-lead, melting point 183°C).
| Alloy | Standard Peak | Xemu Complex 4627 "Hot" Peak | Notes | | :--- | :--- | :--- | :--- | | SAC305 (Lead-free) | 245°C | 270°C | Required for inner row wetting. | | Sn63/Pb37 (Tin-lead) | 210°C | 235°C | Do not use 270°C; you will melt the laminate. |
If you see a specification calling for "Xemu Complex 4627 hot" on a drawing, it is almost certainly lead-free. For tin-lead, request the "warm" profile instead.
In computing, a “hot” path means two things: (1) it consumes a disproportionate amount of CPU/GPU time, and (2) it generates significant thermal output during execution. Complex 4627 is hot for several reasons:
User reports of thermal throttling while running Xemu on laptops or passively cooled desktops often point to a single thread pegged at 100%—this is Complex 4627 in action. The emulator’s profiling tools reveal that this routine can account for over 40% of frame time in certain scenes.