Ufs 3.1 Pinout May 2026

The UFS 3.1 pinout is defined around M-PHY differential pairs plus separate core and I/O voltages. Successful interfacing requires strict power sequencing, clean differential routing, and correct reference clock. Always obtain the chip's dimensioned ball map (from datasheet or board schematic) before soldering or probing.

Last advice: If doing data recovery, use an UFS adapter with pre-configured termination and voltage selection. DIY wiring often fails due to signal integrity loss at HS-G4 speeds (≈ 2.9 Gbps per lane).

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These pins manage power states, reset, and boot flows.

| Pin | Symbol | Function | Active Level | Pull-up/Pull-down | | :--- | :--- | :--- | :--- | :--- | | L1, L2 | RST_N | Hardware Reset. Resets the UFS controller and UniPro layer. | Low (active low) – Must be held low >1ms | 10kΩ pull-up to VCCQ | | R3 | REF_CLK_REQ | Clock Request. Device asserts high to request host enable REF_CLK for low-power exit. | High | Internal pull-down | | T1 | CORE_EN / PWR_EN | Power Enable. Enables internal voltage regulators. Usually tied to host GPIO. | High | Pull-down | | N/A (on some packages) | BOOT_LD | Boot Ladder Enable. Pin-strapping option to force boot from ROM. | High | Pull-down |

   1   2   3   4   5   6   7   8   9  10 11 12 13
A  VCC VCC NC  REF RST NC  NC  NC  NC  NC NC NC NC
               _CLK _N
B  VCC VCC C/D VSS VSS NC  NC  NC  NC  NC NC NC NC
C  VCC VCC D0_ D0_ VSS NC  NC  NC  NC  NC NC NC NC
        Q    Q  RX  TX
D  VCC VCC D1_ D1_ VSS NC  NC  NC  NC  NC NC NC NC
        Q    Q  RX  TX

(NC = No Connect / Reserved)

For a full 153-ball diagram, request the vendor’s mechanical drawing or refer to JEDEC Standard JESD220-3 (UFS 3.1).

Universal Flash Storage (UFS) 3.1 is the high-performance storage standard designed for the 5G era, offering significant speed and power efficiency improvements over previous generations. Understanding its pinout is critical for hardware engineers and developers tasked with integrating this storage into mobile, automotive, and AR/VR systems. The Core Architecture: Low Pin Count, High Speed

Unlike the parallel interface used in older eMMC standards, UFS 3.1 utilizes a serial interface based on the MIPI M-PHY and UniPro specifications. This design choice allows for a significantly lower pin count, which simplifies PCB routing and reduces the physical footprint on space-constrained mobile motherboards.

The physical interface typically resides in a 153-ball BGA (Ball Grid Array) package, which is standard for high-density flash storage. Key Functional Pin Categories

The UFS 3.1 pinout is strategically organized into three primary functional groups: data transmission, power supply, and control/clocking. High-Speed Data Lanes (M-PHY): ufs 3.1 pinout

TX_DP/TX_DN: Differential transmit pairs for data sent from the host to the UFS device.

RX_DP/RX_DN: Differential receive pairs for data sent from the device to the host.

UFS 3.1 supports dual-lane operation, meaning it can utilize two sets of these differential pairs to double its bandwidth, reaching sequential read speeds up to 2,100 MB/s. Power Supply Pins:

VCC: The main power supply for the NAND flash memory, typically operating at 2.5V or 3.3V.

VCCQ: The power supply for the UFS controller and I/O interface, usually 1.2V. The UFS 3

VCCQ2: An additional supply used in some configurations for low-voltage interface operations. Reference Clock and Control:

REF_CLK: A square wave single-ended reference clock input. While UFS can operate without this in low-speed modes (using self-clocked PWM signaling), the reference clock is required for High-Speed (HS) modes to ensure low bit-error rates and fast PLL locking. RST_N: A hardware reset pin used to initialize the device. Hardware Integration and Signal Integrity

UFS 3.1 | Universal Flash Storage | Samsung Semiconductor Global

The UFS 3.1 pinout refers to the physical electrical interface of the Universal Flash Storage (UFS) version 3.1 standard, primarily used in high-end smartphones and automotive systems to achieve ultra-fast data transfer speeds.

Unlike older parallel standards like eMMC, UFS 3.1 uses a serial differential interface that significantly reduces the number of required signal pins while boosting performance. UFS 3.1 Pin Configuration (153-Ball FBGA) (NC = No Connect / Reserved)

Most UFS 3.1 devices are packaged in a 153-ball FBGA (Fine-pitch Ball Grid Array), typically measuring 11mm x 13mm. While the physical grid has 153 positions, only a fraction are active signals; many are reserved for power, ground, or future expansion. The core signals can be categorized into three main groups: 1. High-Speed Serial Data Lanes (MIPI M-PHY)

These pins handle the actual data transfer using the MIPI M-PHY physical layer. UFS 3.1 typically supports up to two lanes in each direction (full-duplex).