Electricalom Crack 2021 -

Take‑away: The convergence of device scaling, heterostructure engineering, and advanced packaging (e.g., flip‑chip on ceramic substrates) is rapidly making WBG devices commercially viable for megawatt‑class converters.

Take‑away: Embedding AI at the device and system levels transforms reactive maintenance into proactive, cost‑effective grid stewardship.

The rapid electrification of transportation, industry, and residential sectors, coupled with aggressive climate‑change mitigation targets, has intensified the demand for high‑efficiency, high‑power‑density conversion technologies. The Electricalom Crack 2021 conference was conceived as a dedicated forum to capture the state‑of‑the‑art in Electrical Crack, an emerging sub‑field focused on the “crack‑like propagation of electrical phenomena in power‑electronic devices and networks*—including breakdown mechanisms, fault propagation, and resilience strategies. Electricalom Crack 2021

Key objectives of the conference were to:

This review paper consolidates the most impactful contributions across the four technical tracks of Electricalom Crack 2021, identifies cross‑track synergies, and proposes a set of research priorities for the next five years. | Metric | Value | |-----------|-----------| | Dates

| Metric | Value | |-----------|-----------| | Dates | 12–16 September 2021 (virtual) | | Registrants | 1,248 (academia: 58 %; industry: 35 %; government: 7 %) | | Sessions | 48 oral presentations, 23 poster sessions, 5 panel discussions | | Keynote Speakers | Prof. Junichi Takahashi (WBG devices), Dr. Sofia García (AI for grid resilience), Prof. Thomas Müller (Cyber‑physical security) | | Awards | Best Paper – “SiC‑based MMC for 10‑MW HVDC Links”; Young Investigator – “Physics‑informed Neural Networks for Fault Diagnosis” |

The conference employed a hybrid format where live streaming of talks was complemented by interactive breakout rooms for poster discussions. All accepted papers were published in the Proceedings of Electricalom Crack 2021 (ISBN 978‑1‑55555‑999‑7) and are indexed in IEEE Xplore and Scopus. when paired with WBG devices

Take‑away: MMCs, when paired with WBG devices, are poised to replace traditional two‑level converters in HVDC and offshore wind applications, delivering superior scalability and fault tolerance.

The Electricalom Crack 2021 symposium, held virtually from 12–16 September 2021, marked a pivotal moment for the global power‑electronics community. Over 1,200 participants from academia, industry, and governmental agencies exchanged cutting‑edge research on semiconductor devices, high‑frequency converters, grid‑integration of renewable energy, and cybersecurity for smart grids. This paper synthesizes the major technical contributions presented at the conference, evaluates emerging trends, and outlines open research challenges. Particular emphasis is placed on (i) wide‑bandgap (WBG) semiconductor breakthroughs, (ii) modular multilevel converter (MMC) architectures for megawatt‑scale applications, (iii) AI‑driven predictive maintenance for distribution networks, and (iv) resilience strategies against cyber‑physical attacks. By contextualizing these findings within the broader trajectory of power‑electronics research, the paper provides a roadmap for researchers and practitioners aiming to accelerate the transition toward resilient, low‑carbon electric power systems.